Thermal Image Processing: Scope and Effectiveness of Software in Mechanical Application

Special Session


This special session will encompass all aspects of image processing techniques which are considered emerging research fields that have recently drawn much attention from computer science and mechanical as well as from social sciences and other disciplines.

Thermal Image Processing are emerging research fields that have recently drawn much attention or distinguished scholars engaged in scientific, engineering and technological research, dedicated to build a platform for exploring and discussing the future of Computer Science and Mechanical Automation with existing and potential application scenarios. The professional interaction, afforded by this congress, will permit individuals with common interests to share ideas and strategies. 

Important Dates

Submission Deadline  :  15 April 2019 

Decision Notification  :  01 May 2019


All accepted and registered papers will be published in Springer Publication Series 

“The Smart Innovation, Systems and Technologies (SIST)”.

ISSN: 2190-3018. 

 The books of this series are submitted to  ISI Proceedings, EI-Compendex, DBLP, SCOPUS, Google Scholar and Springer link... 

Topics of Interest

The topics of interest include (but are not limited to) the following

  • State-of-the-art and evolution in the field of infrared scanners and imaging systems allowing quantitative measurements, and related data acquisition and processing systems.

  • Calibration and characterization of infrared cameras and related topics like certification, standardization, validation, emissivity determination, absorption in media, translucent media, spurious radiations, three dimensionality of observed objects.

  • Characterization of optical and further heat sources for active thermography

  •  Analytical and numerical modeling, data reduction and image processing related to infrared thermography.

  • Application of infrared thermography to radiometry, thermometry, and physical parameters identification and quantification, in all fields: fluid mechanics, solid mechanics, structures and material sciences, non-destructive evaluations, electromagnetism, medicine and biomedical sciences, remote sensing, environment monitoring, industrial processes and other.

All topics are intended to quantitative results comprising temperature values as well as further parameters on the tested materials and structures. The latter ones are usually obtained through active thermography, e. g. by exploiting non-stationary heat transfer processes activated by additional heat sources or by considering wavelength dependent effects.

Passive and active thermography methods and technologies are spread now along a multitude of areas of applications, which all profit from each other.

Find the Springer Template

Find the Springer Template

Contact Us

For any further queries related to this Special Session, please contact chairs

  Prof. (Dr.) Gopinath M P


Prof. (Dr.) Murali S


Prof. (Dr.) Dinesh kumar S



Maisammaguda, Dhulapally, Hyderabad, TS 500100, IN

Organizing Chair & Editor Prof. Dr. A.N.R. Reddy +91-7396978646

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