This special session will encompass all aspects of image processing techniques which are considered emerging research fields that have recently drawn much attention from computer science and mechanical as well as from social sciences and other disciplines.
Thermal Image Processing are emerging research fields that have recently drawn much attention or distinguished scholars engaged in scientific, engineering and technological research, dedicated to build a platform for exploring and discussing the future of Computer Science and Mechanical Automation with existing and potential application scenarios. The professional interaction, afforded by this congress, will permit individuals with common interests to share ideas and strategies.
Submission Deadline : 15 April 2019
Decision Notification : 01 May 2019
All accepted and registered papers will be published in Springer Publication Series
“The Smart Innovation, Systems and Technologies (SIST)”.
The books of this series are submitted to ISI Proceedings, EI-Compendex, DBLP, SCOPUS, Google Scholar and Springer link...
The topics of interest include (but are not limited to) the following
All topics are intended to quantitative results comprising temperature values as well as further parameters on the tested materials and structures. The latter ones are usually obtained through active thermography, e. g. by exploiting non-stationary heat transfer processes activated by additional heat sources or by considering wavelength dependent effects.
Passive and active thermography methods and technologies are spread now along a multitude of areas of applications, which all profit from each other.
Maisammaguda, Dhulapally, Hyderabad, TS 500100, IN
Organizing Chair & Editor Prof. Dr. A.N.R. Reddy +91-7396978646